Solder Paste Inspection (SPI) is an automated 3D optical inspection performed immediately after the solder paste is printed onto the PCB. It precisely measures the volume, height, and alignment of the paste to detect printing defects early. This proactive check prevents soldering issues in subsequent stages, significantly improving production yield and reducing rework.

Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used because it is a non-contact test method.

X-Ray Inspection is a non-destructive test method used to examine hidden solder connections, such as those under BGA and QFN components. It effectively identifies defects like solder voids, bridges, and misalignment that are invisible to the naked eye, ensuring the structural and electrical integrity of complex PCB assemblies.

Visual inspection is a common method of quality control, by using either or all human senses such as vision, hearing, touch and smell and/or any non-specialized inspection equipment to ensure that the manufactured products being made to meet the quality requirements.

In-circuit testing (ICT) means an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated.

Electro-mechanical assembly is essential for the operation of all kinds of devices across a range of industries.  It refers to any assemblies consisting of electrical and mechanical components or subassemblies that work together for a specific function.

Functional test is essential as it ensure the electronic product meets the required specifications and functions correctly. The functional test involves testing each device component to ensure they work perfectly together. That includes testing for compatibility, performance, reliability and safety features. By performing Functional Tests on electronic products during production, manufacturers can save time and money by avoiding costly defects or recalls later.

Burn-in is the process by which modules of a system are exercised before being placed in service. This testing process will force certain failures to occur under supervised conditions so an understanding of load capacity of the product can be established.

Automated Test Equipment (ATE) are computer-controlled systems that perform rigorous and rapid testing on electronic components and assembled PCBs. They execute pre-programmed test sequences to verify functionality, measure performance parameters, and identify defects. By automating complex tests, ATE ensures consistent quality, increases throughput, and reduces human error in high-volume production environments.

The Chroma 8000 is an automated test system for comprehensive power supply validation. It performs full-load testing, efficiency verification, and checks protection circuits like OVP and OCP. This ensures that every power supply meets stringent performance, safety, and reliability standards before delivery.

Conformal Coating is protective, breathable coating of thin polymeric film applied to PCBs.  It provides protection against moisture and other harsher conditions.  It can be applied in a number of ways including brushing, spraying, dispensing and dip coating.

The final quality audit (FQA) process is to ensure the unit has gone through and passed all the manufacturing or test process and is in good quality.